Intel unveils its flagship 3rd generation Xeon Scalable data center chip


Intel on Tuesday unveiled its “new 3rd generation Xeon Scalable” scalable chip that can be used in on-premises servers, edge computing devices, data centers and 5G networks. Intel has shipped over 200,000 of these new chips to cloud computing companies, Cisco, Dell, Lenovo and others.

Intel (INTC) on Tuesday unveiled its new 3rd generation Xeon Scalable processors (codenamed “Ice Lake”), which are 10nm scalable processors for use in data centers, hybrid clouds, 5G networks and edge computing.

According to Intel, the new chips show an average 46% improvement in performance for popular workloads in data centers compared to the previous generation of Ice Lake.

Features of 3rd generation Xeon Scalable processors

  • Intel DL Boost technology allows you to quickly bring artificial intelligence (AI) technologies “into every application from the edge to the network to the cloud.”

  • With Intel SGX technology, “processors solve your most pressing data protection issues.”

  • Intel Crypto Acceleration Technology in the new chips will help run highly encrypted, high-compute workloads.

Intel gave an example of this advantage of new chips used by online stores, which process millions of customer transactions per day and need to protect customer data.

Intel’s new chips will have up to 40 processing cores embedded in a single silicon, and will also be able to access much more memory, which is an important factor for server performance, the company said.

Intel announced that it sold over 200,000 test units of 3rd generation Xeon Scalable processors in the first quarter of 2021.

Clients include the world’s leading cloud service providers and more than 15 major telecommunications equipment and communications service providers, as well as global computer system manufacturers.

The new 3rd generation Ice Lake chips have already been used by companies such as HPE (HPE), Cisco (CSCO), Dell Technologie (DELL), Lenovo and Supermicro in their new products – servers, supercomputers and peripherals.

Naveen Shenoi, executive vice president and general manager of the data platform group at Intel, called the 3rd generation Xeon processor “the most flexible and performing scalable platform” in the company’s history.

“Intel is uniquely positioned in terms of architecture, design and manufacturing,” added Shenoy.

Shenoy said Verizon Communications (VZ) plans to use the new Ice Lake chips. A Verizon spokesperson appeared at the Intel presentation, along with representatives from Microsoft (MSFT), Oracle (ORCL) and others.

Intel prepares to ramp up production

New Intel CEO Pat Gelsinger aims to expand supply chains as he plans to increase production and build new factories.

“We believe we are heading for the largest tech infrastructure build-up in human history,” he said in an interview with Bloomberg.

With strong competition from AMD (AMD) and Nvidia (NVDA) in the data center chip market, Intel hopes its in-house manufacturing operations will help tackle the global chip shortage and compete better.

Marketinfo.pro wrote more about the problem of shortage of microcircuits in the article “The global shortage of semiconductors has affected the shares of these companies.”

According to Intel, its new chips are superior to those from AMD and Nvidia. Through hardware and software optimizations, the new 3rd Gen Ice Lake Chips platform outperforms the 3rd Gen AMD Epyc 7763 chips, delivering up to 1.5x faster performance across a broad mix of 20 popular AI workloads. That said, compared to the Nvidia A100 GPU, the new Intel chip delivers 1.3x faster performance on the same 20 popular AI workloads.

In addition, Intel can get government support from the Joe Biden administration because it manufactures its chips in the United States, unlike its competitors that use contract manufacturers in Asia such as Taiwan Semiconductor Manufacturing (TSM).

According to Reuters, Gelsinger will be attending a meeting that President Joe Biden’s administration has scheduled for April 12 to discuss semiconductor supply chain issues affecting US auto factories. There will likely be discussions about supporting Intel in the construction of its two new chip factories in Arizona.

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